Pulsed Current and Potential Response of Acid Copper System with Additives and the Double Layer Effect
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چکیده
A mathematical model for analyzing the double layer ~dl! effect on pulse plating in the presence of additives is presented. Numerical simulations are employed to predict the influence of additives with various inclusion rates and capacities on current and potential response and mass transfer. It is shown that capacitive current density will not only increase in the presence of additives due to the increase in overpotential but also will increase with increasing dl capacity. Then, the variation of surface concentrations of additives and metal ions will even out as a result of the charging and discharging of the dl. The predicted results are compared with the experimental overpotential response on a copper rotating disk electrode in a bath containing 0.348 M CuSO4 and 2.06 M H2SO4 with and without 100 ppm polyethylene glycol. Good agreement between them is found. © 2002 The Electrochemical Society. @DOI: 10.1149/1.1462793# All rights reserved.
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تاریخ انتشار 2002